High PurityCOA IncludedBulk & Retail Packs
Overview
High-Purity Grade for Plating Baths
Electroplating Grade Copper Sulphate is supplied to a tighter purity specification and lower insoluble-matter content than our general grades, because plating solutions are highly sensitive to impurities — even trace contamination can cause pitting, poor adhesion or uneven deposits.
It is widely used in copper electroplating baths, printed circuit board (PCB) manufacturing, electro-refining and electroforming, where consistent, high-purity copper sulphate solution is essential for a smooth, bright deposit.
Typical Specification
| Parameter | Typical Value |
|---|---|
| Copper Content | ~25% |
| Purity | 99%+ |
| Water Insoluble Matter | ≤ 0.02% |
| Chloride (Cl) | ≤ 0.001% |
| Iron (Fe) | ≤ 0.01% |
| Form | Crystal, screened for uniformity |
Key Applications
Copper electroplating baths
PCB manufacturing
Electro-refining
Electroforming
Packaging
25 kg bags with sealed liners to prevent moisture pickup and contamination; custom packaging available for high-volume plating shops.